How PERC, TOPCon, HJT, and Back-Contact Will Shape Domestic Manufacturing

This talk will share a candid view of how U.S. cell manufacturers evaluate future technologies and what will realistically be available domestically through 2030. Discussion topics include:

Why PERC still dominates U.S. demand and carries strong bankability despite declining global share.
How manufacturers assess the real-world tradeoffs of TOPCon, Pervoskite, HJT and Back-Contact cells.
What a practical U.S. technology-migration roadmap looks like. How domestic incentives and FEOC rules influence technology choices for manufacturers. The role of long-term developer commitments in accelerating U.S. innovation.
What developers should ask manufacturers to verify FEOC-compliant sourcing.
How manufacturers validate wafers, pastes and other components.
The real cost and operational implications of meeting FEOC requirements.
What timelines look like for fully FEOC-compliant wafers and polysilicon in the U.S.
How developers can align long-term procurement strategies with realistic domestic supply ramp-up.
How the industry is handling 232 impacts.